As the speed signal, performance requirements and routing density increasing, the use of advanced technology of PCB is becoming more and more important, as a result, many BGA placeholder area within the PCB design is adopted the via-in-pad plated over (VIPPO) structure or called plated over filled via (POFV) structure.
POFV for PCB,Via-in-pad plated over,IPC4761 Type VII Read More »
The popularity of new energy vehicles will drive the PCB market increase .
The Popularity of New energy vehicles will Drive the PCB Market Increase Read More »
How to choose the surface treatment for PCB with variour applications
How to Choose the Surface Treatment for PCB with Variour Applications Read More »
Holes commonly referred to as vias or vias in PCB producing manufacturing require square measurements inside the PCB to connect disparate layers at different points. Holes may additionally be required to alter leaded parts to be mounted on the PCB. in addition some fixing holes is also required.
A Step by Step Guide for PCB Manufacturing Process Read More »
Here are some practical tips for finding reliable Chinese PCB suppliers.
How can We Find a Good PCB Manufacturer in China Read More »
The final process stage of all PCB is the double side process. This is true for even the most complex, multi-layer PCB.
IPC4761-Type VII Via-in-paid&resin fill and copper cap
IPC4761-Type VII Via-in-paid&resin fill and copper cap Read More »
This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.
Printed Circuit board. This term is usually applied to the completed product consisting a fiberglass core with copper traces n’ spaces on the outer surfaces.
Industry Terms And Acronyms In PCB Manufacturing Read More »
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