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For the festival season is coming ,and PCB material and component increase the price recently.It is very important to provide pcb and pcba projects forecasts and advance planning.
As the speed signal, performance requirements and routing density increasing, the use of advanced technology of PCB is becoming more and more important, as a result, many BGA placeholder area within the PCB design is adopted the via-in-pad plated over (VIPPO) structure or called plated over filled via...
The popularity of new energy vehicles will drive the PCB market increase .
How to choose the surface treatment for PCB with variour applications
Holes commonly referred to as vias or vias in PCB producing manufacturing require square measurements inside the PCB to connect disparate layers at different points. Holes may additionally be required to alter leaded parts to be mounted on the PCB. in addition some fixing holes is also required.
Manufacturing Processes for a Multi-layer PCB
Here are some practical tips for finding reliable Chinese PCB suppliers.
The final process stage of all PCB is the double side process. This is true for even the most complex, multi-layer PCB.
IPC4761-Type VII Via-in-paid&resin fill and copper cap
This article clears up confusion about different via structures in PCB fabrication and lists the pros and cons of each.
